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Agency Recognition for Strap Battery Devices
UL
CSA
TüV
File # E74889
File # 78165C
Certificate number available on request
Installation Guidelines for the Strap Family
? PPTC devices operate by thermal expansion of the conductive polymer. If devices are placed under pressure or installed in spaces that
would prevent thermal expansion, they may not properly protect against damage caused by fault conditions. Designs must be selected in
such a manner that adequate space is maintained over the life of the product.
? Twisting, bending, or placing the PPTC device in tension will decrease the ability of the device to protect against damage caused by
electrical faults. No residual force should remain on device after installation. Mechanical damage to the PPTC device may affect device
performance and should be avoided.
? Chemical contamination of PPTC devices should be avoided. Certain greases, solvents, hydraulic fluids, fuels, industrial cleaning agents,
volatile components of adhesives, silicones, and electrolytes can have an adverse effect on device performance.
? PPTC strap devices are designed to be resistance welded to battery cells or to pack interconnect straps, yet some precautions must be
taken when doing so. In order for the PPTC device to exhibit its specified performance, weld placement should be a minimum of 2mm from
the edge of the PPTC device, weld splatter must not touch the PPTC device, and welding conditions must not heat the PPTC device above
its maximum operating temperature.
? PPTC strap devices are not designed for applications where reflow onto flex circuits or rigid circuit boards is required.
? The polyester tape on PPTC strap devices is intended for marking and identification purposes only, not for electrical insulation.
? The coating on MXP devices is intended to prevent oxidization/aging of the devices. Damaging the coating or causing the coating to
delaminate can have negative effects on device performance and should be avoided.
? MXP devices have small PPTC chip size and therefore have weaker peel strength between polymer and Ni-foil of the chip. Excessive
mechanical force to the device may cause delamination of Ni-foil from polymer.
Part Numbering System for Strap Battery Devices
VTP 210 SF
Modifier
B, BB = Modified resistance window
D = Short leaded strap
F = Lead-free version
G = Global design (standard product)
L = Long lead or leads
S = Slit lead
SS = Both leads slit
U = Untaped
X = Rotated chip
Hold Current Indicator
Product Series
12
Warning :
? Users should independently evaluate the suitability of and test each product selected for their own application.
? Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
? These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should
not be used when repeated fault conditions or prolonged trip events are anticipated.
? Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.
? Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and
mechanical procedures for electronic components.
? PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited,
for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.
? Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device.
RoHS Compliant, ELV Compliant
211
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